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CoolIT Systems Showcases Liquid Cooling Innovations at SC17

CoolIT Systems is showcasing their innovative liquid cooling solutions at SC17 in Denver this week. “As the most popular integration partner for OEM server manufacturers, CoolIT will showcase liquid-enabled servers from Intel, Dell EMC, HPE, and Huawei. Combined with the broadest range of heat exchangers and supporting liquid infrastructure, CoolIT and their OEM partners are delivering the most complete and robust liquid cooling solutions to the HPC market.”

CoolIT Systems Unveils AHx2 Heat Exchange Module

Today CoolIT Systems announced their new AHx2 Heat Exchange Module. This compact Liquid-to-Air heat exchanger makes it possible for Direct Contact Liquid Cooling (DCLC) enabled servers to be thermally tested during the factory burn-in process, without additional liquid cooling infrastructure. 

CoolIT Systems AHx10 Heat Exchanger Delivers Rack Level Cooling without Facility Water

Today CoolIT Systems unveiled their new AHx10 Heat Exchange Module. This latest member of the CoolIT lineup is a rack mounted Liquid-to- Air heat exchanger that enables dramatic increases in server density without the need for any facility water. “Data centers struggling to manage the heat from high density racks now have a solution with the AHx10 that requires no facility modification,” said CoolIT Systems VP of Product Marketing, Pat McGinn. “The plug and play characteristics of the AHx10 make it a high flexible, simple to install solution that delivers the great benefits of liquid cooling immediately.”

Canada’s Biggest Radio Telescope to use CoolIT Systems Liquid Cooling

With support from CoolIT Systems with a custom Direct Liquid Cooling solution, the CHIME telescope will map out the entire northern sky each day, aiming to constrain the properties and evolution of Dark Energy over a broad swath of cosmic history. “The liquid cooled system consists of 256 rack-mounted General Technics GT0180 custom 4u servers housed in 26 racks managed by CoolIT Systems Rack DCLC CHx40 Heat Exchange Modules. The custom direct contact cooling loops manage 100% of heat generated by the single Intel Xeon E5 2620v3 CPUs and the Dual AMD FirePro S9300x2 GPUs, while simultaneously pulling heat from the ambient air into the liquid coolant loops.”

What Lies Ahead for HPC Cooling?

“To meet the ambitious targets for exascale computing, many cooling companies are exploring optimizations and innovative methods that will redefine cooling architectures for the next generation of HPC systems. Here, some of the prominent cooling technology providers give their views on the current state and future prospects of cooling technology in HPC.”

Liquid Cooling Ecosystem Expands for HPC with CoolIT Systems

In this video, CoolIT Systems debuts high TDP processor coldplates, STULZ Micro Data Center with Rack DCLC™, and new liquid cooled OEM servers at ISC High Performance 2017 in Frankfurt Germany.

STULZ and CoolIT Systems Launch Liquid Cooled Micro Data Center for HPC

“The Micro DC is a compact data center that can be easily deployed in any environment while managing an incredible amount of power and performance,” said Joerg Desler, President of STULZ USA. “It’s modular system is configured to use various combinations of liquid and air cooling allowing the system to grow with the customer’s needs. Integrating STULZ technology with CoolIT Systems Rack DCLC has resulted in ultra-efficient total thermal solutions that can support any OEM server at even the highest density configurations.”

Peter Calverley Joins CoolIT Systems’ Board of Directors

Today CoolIT Systems announced that Peter Calverley, CFO of Tela Innovations, has been elected to CoolIT’s Board of Directors. Doug Reid has retired from the Board after 5 years of service. “I am excited to join the Board of Directors at CoolIT Systems – a company leading the industry with its innovative, energy efficient direct contact liquid cooling solutions,” said Peter Calverley. “I believe CoolIT’s unmatched technology presents an enormous opportunity to facilitate a step-change in data center computational capabilities.”

CoolIT Systems Issued U.S. Patent for Modular Heat-Transfer Solutions

“U.S. Patent 9,496,200 protects the invention of utilizing a modular, building block approach for datacenter cooling with direct contact liquid cooling,” said Geoff Lyon CEO, CoolIT Systems. “CoolIT’s commitment to developing and patenting unique solutions provides our customers with the assured competitive advantage they are looking for. The 60 patent milestone adds confirmation to CoolIT’s leadership in developing innovative liquid cooling solutions for modern data centers.”

CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling

In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmosphere™ data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems’ DCLC™ solutions can capture 85% and more of the servers’ heat directly into liquid. Complimenting DCLC™, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.