Dec. 9, 2025: Cornellis Networks and Supermicro have announ ced Supermicro’s FlexTwin server platforms are now validated with Cornelis’ CN5000 networking for AI and HPC clusters. Cornelis’ CN5000 400Gbps networking platform is designed to address communication bottlenecks by providing data movement between servers — a critical factor in large AI and HPC deployments. Supermicro’s FlexTwin […]
Cornelis Networks and Supermicro Collaborate on Integrated AI-HPC Offering
Gates Launches Halogen-Free Data Center Liquid Cooling
DENVER — Power transmission and fluid power solutions company Gates Corporation has launched the Data Master Eco liquid cooling solution is designed for hyperscale data centers and high-performance computing conditions. “The Data Master Eco and our broader Data Center Solutions portfolio underscore our strategy to lead in high-value, high-growth markets,” said Ivo Jurek, chief executive […]
AMD Showcases ‘Helios’ Rack-Scale Platform on the OCP Open Rack Wide Spec
Today at the Open Compute Project (OCP) Global Summit in San Jose, AMD (NASDAQ: AMD) showcased a static display of its “Helios” rack scale platform for the first time. Developed based on the new Open Rack Wide (ORW) specification, introduced by Meta, AMD said Helios extends the AMD open hardware philosophy from silicon to system […]
HPC News Bytes 20251006: Quantum (Information) Supremacy at UT Austin, Big Cloud Balances BYO vs Merchant AI Chips, Surprise Players in AI Infrastructure Market
Good October day to you! HPC-AI, the industry that never sleeps, has served up its usual stew of ….
Cerebras Raises $1.1B at $8.1B Valuation
Cerebras Systems’ dinner plate-size chip technology has been a curiosity since the company introduced the Wafer Scale Engine in 2019. But it’s become more than just a curiosity to the AI industry — and to the venture community. Today, Cerebras announced an oversubscribed $1.1 billion Series G funding round at $8.1 billion valuation. This as […]
Schneider Electric Unveils Liquid Cooling Portfolio for HPC and AI
Rueil-Malmaison, France, September 29, 2025 – Schneider Electric today unveiled its portfolio of end-to-end liquid cooling solutions for hyperscale, colocation and high-density data center environments, engineered to enable the AI factories. Available globally, the Motivair by Schneider Electric cooling solutions meet the power and GPU-intensive demands of high-density data centers reliably, and at scale. The complete […]
HPC News Bytes 20250929: ‘World Models’ Next Big AI Thing?, ‘Central Park-Sized’ Data Centers, Silicon Cooling Advancement, How to Tame a 6K+ Qubit Array
Good late-September morning to you! The HPC-AI world last week barreled ahead at breakneck ….
Microsoft: In-Chip ‘Microfluidics’ Improves Silicon Cooling 3X
Microsoft reported today it has successfully tested a new cooling system that removed heat up to three times better than cold plates. The system is called microfluidics, an approach that brings liquid coolant directly inside the silicon.
Microsoft Standing up $3.3B ‘Most Powerful’ AI Data Center in Wisconsin with $4B Facility to Follow
In its not-so-modest opinion, Microsoft calls it the world’s most powerful AI data center. In a blog post from vice chair and president Brad Smith, he calls it ….
CPC and the Connector’s Critical Role in the Liquid Cooled AI Data Center
With today’s growing adoption in the AI data center of liquid cooling – essential for controlling AI cooling costs and energy usage – minimizing risk includes the use of high-quality connectors. Liquid cooling connectors are crucial ….













