LiquidStack Secures $20M Series B Funding from Tiger Global

CARROLLTON, Texas, September 19, 2024 — LiquidStack today announced it has secured a $20 million Series B extension investment from leading investment firm Tiger Global, bringing LiquidStack’s total Series B funding round to $35 million. The full service liquid cooling provider will use the funds to expand its manufacturing footprint, scale its direct-to-chip and immersion cooling […]

ZutaCore and Munters Team on Waterless Data Center Architecture for AI Factories

SAN JOSE, Sept. 17, 2024 — ZutaCore, a provider of direct-to-chip, waterless liquid cooling solutions, and Munters, an air treatment and climate solutions company, today announced the integration of their two platforms to provide a two-phase, waterless liquid cooling to cool AI factories faced with massive power densities driven by AI accelerators. The solution is designed […]

Gates Launches Data Master Hose for Data Center Cooling

DENVER, Sept. 10, 2024 — Power transmission and fluid power product maker Gates (NYSE: GTES) announced the launch of the Data Master Data Center Cooling Hose. This fluid conveyance solution, a result of Gates Eco-Innovation process, is intended for data center liquid cooling applications driven by compute-intensive applications such as artificial intelligence. This addition to Gates’ fluid conveyance […]

LiquidStack Launches ‘Universally Compatible’ Coolant Distribution Unit

CARROLLTON, Texas, August 22, 2024 — Data center liquid cooling company LiquidStack  today announced the availability of CDU-1MW, a high-performance coolant distribution unit (CDU) designed to be universally compatible with commercial direct-to-chip (DTC) solutions. LiquidStack’s CDU-1MW system is available now. Built for advanced computing applications such as generative AI, large language models and HPC, LiquidStack’s […]

Lenovo Launches Expanded Portfolio of AI Solutions

Today, Lenovo unveiled an expanded portfolio of enterprise AI solutions designed to help companies develop and deploy AI with “turnkey services, business-ready vertical solutions and energy-efficient innovations ….

HPC News Bytes 20240610: Clinical Trials for HPC-Discovered Drug, New Liquid Cooling Technique, CHIPS Act Update, Low Memory-Low Power AI

Good June morning! It’s been an interesting week in HPC-AI, here’s a quick (6:53) review of the latest news and trends: Clinical trials for cancer fighting drug discovered ….

Taking Liquid Cooling to Next Level: Sandia Researchers Say Direct Immersion May Cut Power Use by 70%

…. by directly submergining electrical circuits and components in fluid that does not conduct electricity, Sandia National Laboratories researchers are taking liquid cooling to another level …. 

‘Microjet Impingement’ Liquid Cooling Advances as AI Heat Rises

Single-phase direct-to-chip liquid cooling, particularly effective with “microjet impingement,” targets coolant directly at the hottest chip parts, managing high heat loads while boosting silicon performance. This method, which can cool chips over 2,000W ….

Cabinet Technology is Bridging the Efficiency of Air Cooling with the Performance of Liquid Cooling for HPC and AI Workloads

[SPONSORED GUEST ARTICLE] Data center operators need to modernize and future-proof their facilities, so they don’t get left behind as AI and HPC deployments expand. While the industry is exploring several liquid cooling …. 

Accelsius Announces NeuCool Direct Liquid Cooling

AUSTIN, Texas – Accelsius, whose patented two-phase direct-to-chip liquid cooling systems enable high-performance computing and compute density for data center and edge computer operators, today announced NeuCool, its in-rack solution that delivers unmatched thermal performance, the company said. With a capacity that has been tested beyond 1,500 watts per server chip (CPU, GPU, hot components), […]