SC24 here in Atlanta is off to a great start with more than 17,000 attendees (a 21 percent increase over 2023), 480 exhibitors from 29 countries and a new TOP500 list that features a new champion supercomputer!
@HPCpodcast: An Analysis of the New TOP500 List of Top Supercomputers
November 18, 2024 by Leave a Comment
TOP500 at SC24: El Cap on Top, U.S. Now Has 3 Exascale Supercomputers
November 18, 2024 by Leave a Comment
Here in Atlanta at SC24, where an anticipated 16,000 attendees are expected to set a conference attendance record, the new TOP500 list of the world’s most powerful supercomputers reports that El Capitan, the HPE-Cray/AMD supercomputer at Lawrence ….
@HPCpodcast: Torsten Hoefler on the Present and Future of HPC-AI – ‘The Age of Computation’
November 15, 2024 by
Special guest and a leading light of the HPC community, Prof. Torsten Hoefler of ETH-Zurich, joins Shahin and Doug for a lively discussion on his vision of HPC-AI’s present and future, which he calls “The Age of Computation.” For Torsten this is an umbrella term covering all ….
Biden Administration ‘Races’ to Allocate CHIPS Act Funds
November 7, 2024 by
With the election over and potential threats to the CHIPS Act coming from victorious Republicans, the White Houe is reportedly racing “to get CHIPS Act money out the door” before the Biden presidency ends in January ….
BullSequana eXascale Interconnect V3: Intelligent Network Management Accelerates GPU Performance in AI-HPC
November 6, 2024 by
[SPONSORED GUEST ARTICLE] While the compute power of GPUs has grown significantly…, networking infrastructure has not kept up at the same rate.
Move Over Von Neumann? Sandia to Deploy NextSilicon’s ‘Intelligent Compute Accelerator’
October 30, 2024 by
NextSilicon, the Israel-based startup whose intriguing software-defined hardware has been talked about in concept for years by the company, today unveiled what it said is the first Intelligent Compute Accelerator (ICA).
Infineon Unveils Thin Silicon Wafer for AI Data Centers
October 29, 2024 by
Infineon Technologies AG announced it has unveiled an advance in handling and processing “the thinnest silicon power wafers ever manufactured,” with a thickness of 20 micrometers and a diameter of 300 millimeters, in a high-scale semiconductor fab.
Pain of Porting: The Limitations and Costs of GPU-Driven HPC-AI
October 24, 2024 by
[OPINION/INSIGHT ARTICLE] At the heart of the porting challenge lies the need to harmonize diverse and rapidly evolving software ecosystems and hardware architectures. Current strategies to address the challenges of porting applications to diverse processor architectures often fall short….
Lenovo @ SC24: Smarter Creates Cooler HPC
October 23, 2024 by
[SPONSORED GUEST ARTICLE] SC24, the industry’s leading HPC technical conference, is taking place next month, and Lenovo will be there. HPC enthusiasts, influencers, and experts will gather in Atlanta, Georgia from November 17 – 22nd at the Georgia World Congress Center. This year, Lenovo’s theme is Smarter ….
Breaking the ICE at Livermore: ICECap to Use Exascale Fusion Simulations for Digital Design
October 17, 2024 by
A multidisciplinary team of Lawrence Livermore National Laboratory researchers is combining the power of exascale computing with AI, advanced workflows and GPU-acceleration with the intent to advance scientific innovation and revolutionize digital design.
