Amkor and TSMC Collaborate on Advanced Packaging in Arizona

TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 – TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor’s outsourced semiconductor assembly and test (OSAT) services, in their planned facility in Peoria, Arizona. TSMC will leverage […]