Found at HPCwire
Applied Math Modeling Inc. announced today the release of CoolSim 3.1 for modeling the thermal environment of datacenters. CoolSim 3.1 adds many new features for the rapid creation and analysis of datacenters, including the ability to model non-raised floor scenarios.
CoolSim has a GUI to help you model your datacenter and create the input decks for an ANSYS/Fluent simulation.
Once the simulation is complete, HTML output reports and 3D visual images are produced and sent to the user. This mechanism allows users to perform multiple “what-if” studies of their datacenters to determine the optimal placement of existing equipment, or the effect of adding new equipment to an existing room.