Asetek will highlight its direct-to-chip (D2C) RackCDU hot-water liquid cooling system with prototype servers from HP, Cisco and Fujitsu. In addition, Cray’s supercomputer CS300-LC with RackCDU will be on display. RackCDU is a hot water, direct-to-chip, data center liquid cooling system that enables cooling energy savings of up to 80% and density increases of 2.5x when compared to modern air cooled data centers. RackCDU removes heat from CPUs, GPUs, memory modules and other hot spots within servers and takes it out of the data center using liquid where it can be released for free using outside air, or recycled to generate building heat and hot-water. RackCDU is currently available for deployment.
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