In this video from the 2013 GPU Technology Conference, Pierre Spatz from Murex provides an update on how GPUs are used on Wall Street.
Industry Perspectives
The Rising AI Tide in HPC – Are You Ready?
This guest article from Dr. Bhushan Desam, Lenovo’s Director, Global Artificial Intelligence Business covers how new HPC tools like Lenovo's LiCO (Lenovo Intelligent Computing Orchestration) are working to address the growing popularity of AI in HPC and to simplify the convergence of HPC and AI. [Read More...]
White Papers
Enabling Next-Generation Platforms Using Intel’s 3D System-in-Package Technology
This white paper evaluates system requirements for next-generation platforms and explains why conventional solutions may no longer be able to meet these requirements effectively. The paper introduces the heterogeneous 3D system- in-package (SiP) technology featured in Intel Stratix 10 FPGAs and SoCs. This technology enables next-generation platforms by powering higher bandwidth, lower power, a smaller form factor, and increased functionality and fledibility. Stratix 10 FPGAs and SoCs feature 3D SiP-based transceivers across all densities.
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