Seoul, April 19, 2024 – Memory company SK hynix Inc. announced today a memorandum of understanding with TSMC to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced […]
[SPONSORED GUEST POST] The AMD HPC User Forum is holding a technical workshop prior to ISC High Performance on Sunday, May 12th, 2024, from 8:00AM – 12:00PM in Hamburg, Germany. The event will cover the AMD Instinct™ MI300 Series products, as well as the ROCm™ stack for HPC and AI.
The high-performance computing (HPC) market is witnessing a notable shift towards the cloud, partially driven by the benefits of enhanced energy efficiency. According to Hyperion Research nearly every organization running HPC workloads is either already using or investigating the cloud to accelerate application performance, with the cloud market for HPC workloads forecast to reach $11.5 […]
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