Today Asetek announced their first order for its RackCDU data center liquid cooling solution placed by one of its Original Equipment Manufacturing (OEM) partners for an undisclosed end customer. A total of 5 RackCDUs with cooling loops for a total of 280 compute nodes will be purchased for use in the HPC cluster.
It is rewarding for our investors, employees and customers to see our business model validated in this way,” said André Sloth Eriksen, Founder and CEO of Asetek. “This pivotal step shows that our data center solutions address the pain points of today’s data center operators in a practical and cost effective way.”
RackCDU is Asetek’s innovative hot water, direct-to-chip, data center liquid cooling technology which removes up to 80% of the heat from servers with an all liquid path and rejects it into ambient outdoor air without chilling. This enables cooling cost reductions in excess of 50%, density increases of 2.5x, and recovery of all the server energy removed by RackCDU for reuse in facility heating and cooling. Visit Asetek.com to read more about Asetek’s data center liquid cooling solutions.
In this video, Steve Branton and David Garcia from Asetek describe the company’s innovative hot-water liquid cooling solutions for HPC.
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