In this slidecast, Tom Trainer and John Kreisa present Gluster – A Better Way to Do Storage.
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Industry Perspectives
How Lenovo is Helping Build Ai Solutions to Solve the World's Toughest Challenges
In this video from SC18 in Dallas, Madhu Matta from Lenovo describes how the company is driving HPC & Ai technologies for Science, Research, and Enterprises across the globe. "Lenovo cares about solving real-world problems, and working with researchers is one of the best ways to gather insights from those whose daily work involves high-computing data and analytics to do just that." [Read More...]
White Papers
Enabling Next-Generation Platforms Using Intel’s 3D System-in-Package Technology
This white paper evaluates system requirements for next-generation platforms and explains why conventional solutions may no longer be able to meet these requirements effectively. The paper introduces the heterogeneous 3D system- in-package (SiP) technology featured in Intel Stratix 10 FPGAs and SoCs. This technology enables next-generation platforms by powering higher bandwidth, lower power, a smaller form factor, and increased functionality and fledibility. Stratix 10 FPGAs and SoCs feature 3D SiP-based transceivers across all densities.
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