Sign up for our newsletter and get the latest HPC news and analysis.
Send me information from insideHPC:


Huawei Showcases FusionServer X6000 at SC16

x6000-new-01This week at SC16, Huawei launched their next-generation FusionServer X6000 HPC platform. Designed for compute-intensive workloads, the FusionServer X6000 offers higher efficiency and greater flexibility than previous systems.

Huawei’s new-generation FusionServer X6000 HPC platform, based on the Intel Scalable System Framework, provides the balanced performance, scalability, and flexibility to efficiently handle a wide range of HPC workloads,” said Hugo Saleh, Director of Marketing and Enabling, Intel Scalable Datacenter Solutions. “The FusionServer X6000 is a great example of how Intel Xeon processors and Intel Omni-path architecture can combine to build industry leading solutions with innovative fabric features that optimize performance, resiliency, and traffic movement.”

The X6000 HPC platform uses an innovative liquid cooling solution that features a skive fin micro-channel heat sink for CPU heat dissipation and processing technology where water flows through memory modules. The platform delivers a node liquid cooling percentage greater than 85%. Its modular design and 50ºC warm water cooling function offers customers high energy-efficiency and flexible deployment, and reduces total cost of ownership (TCO) by up to 40% for large-scale deployment.

The platform also accommodates four 2-socket server nodes in a 2U chassis and presents an outstanding all-flash storage capability of 24x NVMe SSDs per chassis. Based on the high bandwidth and low latency features of 100 Gbps networks, the X6000 HPC platform can achieve a single-node throughput of 4.8 million IOPS.

Additional Technologies on Display at SC16 included:

  • Huawei also showcased high-density servers FusionServer E9000 and X6800 with 100G high-speed interconnect technology and powerful cluster scalability. These servers can dramatically accelerate industrial CAE simulation. Huawei was also displaying its KunLun supercomputer, which features the company’s proprietary Node Controller interconnect chips. KunLun supports up to 32 CPUs and is perfect for cutting-edge research scenarios that require frequent in-memory computing. Additionally Huawei’s high-performance storage solutions, OceanStor 9000 and ES3000 SSD, which can effectively improve data transmission bandwidth and latency, are on display.
  • Huawei and ANSYS announced the two parties’ partnership in building industrial computer aided engineering (CAE) solutions, and jointly released their Fluent Performance white paper, which details optimal system configurations in fluid simulation scenarios for industry customers.
  • Huawei and A*STAR Computational Resource Centre (A*CRC) jointly presented InfiniCortex during SC16, an international project led by A*CRC Singapore which demonstrates a worldwide high-speed fabric which brings together supercomputing facilities from four continents.
  • Huawei and Bright Computing showcased an HPC cloud cluster management solution, which enables organizations to easily and efficiently consume HPC resources from the cloud.
  • Huawei has increasingly become more prominent in the HPC market. It has successfully deployed HPC clusters for a large number of global vehicle producers, large-scale supercomputing centers, and research institutions. These show that Huawei’s HPC platforms are optimized for industry applications which can help customers significantly simplify service processes and improve work efficiency, enabling them to focus on product development and research.

See our complete coverage of SC16

Sign up for our insideHPC Newsletter

Leave a Comment

*

Resource Links: