HPC4Mfg will host their first annual High Performance Computing for Manufacturing Industry Engagement Day on March 2-3 in San Diego. With a theme of “Spurring Innovation in U.S. Manufacturing Through Advanced Computing,” the conference will bring together representatives from U.S. manufacturing, national laboratories, universities, and consortiums to discuss the recent advancements in manufacturing realized through the application of HPC and how leveraging HPC expertise through public-private partnerships has lowered the risk of adoption.
Participants will discuss the barriers to broader use of HPC in manufacturing and review the progress of the HPC4Mfg program to date in helping break down those barriers. In addition, participants will discuss ways the program can be applied more broadly to increase its impact on U.S. manufacturing and competitiveness.
- Richard B. Arthur, General Electric/GE Research
- Mario Longhi, United States Steel Corporation
- Thomas J. Lange, Technology Optimization & Management LLC
- Mark Johnson, U.S. Department of Energy
- Barbara Helland, U.S. Department of Energy
- Chad Evans, U.S. Council on Competitiveness
- Lori A. Diachin, Lawrence Livermore National Laboratory
- Sid Voorakkara, California Governors Office of Business and Economic Development
- Robin R. Miles, HPC4Mfg Program, Lawrence Livermore National Laboratory
- Chenn Q. Zhou, Purdue University Northwest
- Christopher A. Herbst, Eaton
- Alan Taub, University of Michigan/Lightweight Innovations for Tomorrow
- Peter Nugent, Lawrence Berkeley National Laboratory
- Jeffery J. Roberts, Lawrence Livermore National Laboratory
- Thomas W. Wideman, Actasys, Inc.
- Wayne E. King, Lawrence Livermore National Laboratory
- David Turpin, Agenda 2020 Technology Alliance
- John Turner, Oak Ridge National Laboratory
- David Skinner, Lawrence Berkeley National Laboratory
At the start of the conference the U.S. Department of Energy’s (DOE’s) HPC4Mfg Program will announce the industry proposals selected for the latest round of funding and the next call for proposals. Companies such as US Steel and GE will discuss their experience with the program and the benefits of using supercomputers.
The conference is sponsored by DOE’s HPC4Mfg program, a partnership of Lawrence Berkeley, Lawrence Livermore and Oak Ridge national laboratories; DOE’s Office of Science; and the DOE Energy Efficiency & Renewable Energy’s Advanced Manufacturing Office. Participants include: United States Steel Corporation, General Electric/Research, Technology Optimization & Management, U.S. Council on Competitiveness, Purdue University as well as other representatives from industry and academia.