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CoolIT Systems Launches Liquid Cooling Solution for Intel Server System S9200WK

Intel Server System S9200WK

Today CoolIT Systems announced an integrated liquid cooling solution to support the Intel Server System S9200WK.

The Intel Server System S9200WK uses CoolIT’s innovative Rack DLC coldplate solution, featuring patented Split-Flow design. The liquid cooling solution for this 2U, four node server manages heat from the recently announced dual Intel Xeon Platinum 9200 processor CPUs, voltage regulators, and memory. A sample of the DLC enabled Intel server will be showcased by CoolIT during ISC19 from June 17-19 in Frankfurt, Germany.

Direct Liquid Cooling is increasingly becoming the norm for server OEMs looking to enable high performance processors while meeting or exceeding energy efficiency targets”, says CoolIT Systems Director of Data Center Solutions, Brandon Peterson. “This Intel server platform showcases how liquid cooling can be implemented without sacrificing serviceability.”

CoolIT’s Rack DLC technology is the leading choice for tier 1 server OEM’s around the world. With the highest performing coldplates on the market, and a complete supporting product ecosystem including Coolant Distribution Units and Rack Manifolds, HPC data centers around the world are using CoolIT technology to enable higher performance servers, increase rack density, and lower their total cost of ownership.

The Intel Server System S9200WK product family is a purpose built, performance-optimized data center block ideal for use in high performance computing (HPC) and Artificial Intelligence applications. Designed for the Intel Xeon Platinum 9200 series processors, with up to 24 DDR4 DIMM slots per compute module, the S9200WK family maximizes processor and memory bandwidth to provide leadership performance for the most demanding compute use requirements.

Intel Xeon Platinum 9200 Processors Advanced Performance

  • Leadership CPU performance per socket with Intel’s highest core count, Intel Xeon Platinum 9200 processors
  • Double the memory bandwidth for memory-intensive workloads with 12 memory channels per CPU, 24 memory channels per compute module
  • New Intel Deep Learning Boost (Intel DL Boost) Instructions for data analytics greatly accelerates inference performance
  • Multi-Chip packaging optimized for density and performance

Density Optimized 2U Rack Server with Air-Cooled and Liquid-Cooled Options

  • Up to 4 compute modules per 2U chassis which can support multiple compute module types in a single chassis
  • 2 CPU compute module design with advanced cooling technology for high flow rate air or liquid cooled for CPUs, VRs, DIMMs, and memory VRs for high heat capture ratio
  • Up to 350W processor TDP for high performance workloads in a 2U air cooled chassis, up to 400W processor TDP with liquid-cooled versions
  • Up to 2 x16 PCIe* slots in 1U compute modules, up to 4 x16 PCIe slots in 2U compute modules for network expansion options
  • Support for 2x M.2 SATA/NVMe storage devices per 1U compute module, up to 2x M.2 SATA/NVMe* and 2x U.2 NVMe storage devices per 2U compute module
  • Hot-swappable compute modules, storage, fans, and power supplies

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