Here’s a rapid (5:54) rundown of recent news from the HPC-AI sector, including: DOE and LLNL lead effort to go ‘beyond’ EUV lithography, report: ByteDance pursues chip trade sanction workaround, Microsoft’s $80B AI ….
HPC News Bytes 20250106: ‘Beyond’ EUV Lithography, China Chip Sanction Workaround, Microsoft’s $80B AI Build-Out, TSMC 2nm in 2025
January 6, 2025 by
Livermore Lab Team Boosts Trust in AI for Science by Making Machine Learning Explainable
August 1, 2023 by
As machine learning techniques become increasingly used in the sciences, a team of researchers in Lawrence Livermore National Laboratory’s Computing and Physical and Life Sciences directorates are trying to provide a reasonable starting place for scientists who want to apply machine learning but lack a strong ML background. The goal is to help users understand […]
