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Liquid Cooling: Unlock Greater Potential in HPC

Werner Scholz from XENON Systems gave this talk at the Perth HPC Conference. “Today, Intel’s highest performing CPUs (e.g. Intel Cascade Lake-AP 9282 processor) have a thermal design envelope of 400 watts. There really is no end in sight, and accommodating more power is critical to advancing performance. The ability to dissipate the resulting heat is the hard ceiling that systems face in terms of performance – giving greater importance to liquid cooling breakthroughs. With liquid cooling, less energy is expended to cool systems – a significant savings in HPC deployments with arrays of servers drawing energy and generating heat.”