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Asetek Liquid Cooling Solution Coming to HPC Center

Today Asetek announced a new order from one of its existing OEM partners for its RackCDU D2C (Direct-to-Chip) liquid cooling solution. The order is part of a new installation for an undisclosed HPC customer. “I am very pleased with the progress we are making in our emerging data center business segment,” said André Sloth Eriksen, CEO and founder of Asetek. “This repeat order, from one of our OEM partners, to a new end customer confirms the trust in our unique liquid cooling solutions and that adoption is growing.”

Making it Easy to Introduce Liquid Cooling to the Data Center

With the release of high wattage processors liquid cooling is becoming a necessity for HPC data centers. Liquid cooling’s ability to provide the direct removal of heat from these high wattage components within the servers is well established. However, there are sometimes concerns from facilities management that need to be addressed prior to liquid cooling’s introduction to the data center.