In this video from ISC 2016, Steve Branton from Asetek describes the company’s innovative liquid cooling solutions for HPC.
“Because liquid is 4,000 times better at storing and transferring heat than air, Asetek’s solutions provide immediate and measurable benefits to large and small data centers alike. RackCDU D2C is a “free cooling” solution that captures between 60% and 80% of server heat, reducing data center cooling cost by over 50% and allowing 2.5x-5x increases in data center server density. D2C removes heat from CPUs, GPUs, memory modules within servers using water as hot as 40°C (105°F), eliminating the need for chilling to cool these components.”
