CARLSBAD, Calif., July 16, 2024 – Chilldyne, a provider of direct-to-chip liquid cooling solutions, has released its data center liquid cooling starter kit designed to prepare data centers for the workloads being driven by AI computing. With high-density racks of up to 150 kW and higher in the future, data center operators need to be […]
Liquid Cooling Trends in HPC
January 24, 2020 by
In this special guest feature, Bob Fletcher from Verne Global reflects on how liquid cooling technologies on display at SC19 represent more than just a wave. “My intuition suggests that the larger established water-cooling users will mostly stick with their familiar high-pressure solution, but the newer green field deployments will be fertile ground for the new vacuum CDUs. In particular, the AI community as their compute accelerators become increasingly water-cooled, while maintaining their short 2-year product life.”
