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Asetek Liquid Cooling comes to Latest Intel Compute Modules at ISC18

Today Asetek announced plans to showcase its latest liquid cooling technology integrated in Intel Compute Modules at ISC 2018 in Frankfurt. “Asetek is excited with this next step in the ongoing collaboration with Intel,” said John Hamill, Asetek Chief Operating Officer. “The integration of Asetek liquid cooling technology in Intel Compute Modules HNS2600BPBLC and HNS7200APRL serves as further validation of low pressure distributed liquid cooling for HPC and Data Center sites.”