SEATTLE, January 29, 2025 – Emerald, a venture capital company, has invested in NLM Photonics to help bring energy-efficient, high performance electro-optic modulation technology to AI, data centers, quantum computing, and more. Other investors include Oregon Venture Fund, Tokyo Ohka Kogyo Co., Ltd., Pack Ventures, StoryHouse Ventures, and other existing NLM investors to support NLM’s […]
Photonic Interconnect: Lightmatter Joins UALink Consortium
December 18, 2024 by
Dec. 18, 2024, MOUNTAIN VIEW, Calif. –Photonic interconnect company Lightmatter has joined the Ultra Accelerator Link Consortium (UALink), an industry initiative focused on creating high-speed, low-latency open interconnect standards for scale-up AI systems. As a Contributor member, Lightmatter will apply its Passage technology—a 3D-stacked photonic engine—for accelerator-to-accelerator communication, enabling unprecedented performance in AI clusters. The UALink […]
Optical Interconnect: Ayar Labs Secures Investments from AMD, Intel Capital, NVIDIA in $155 Round
December 11, 2024 by
SAN JOSE – Dec. 11, 2024 – Ayar Labs, an optical interconnect company for large-scale AI workloads, today announced it has secured $155 million in financing led by Advent Global Opportunities and Light Street Capital. This brings the company’s total funding to $370 million and raises the company’s valuation to above $1 billion. The strength of the […]
Lightmatter and Amkor Technology Partner on 3D Photonics Package
November 14, 2024 by
MOUNTAIN VIEW, Calif., Nov. 14, 2024 — Photonic supercomputing company Lightmatter today announced a strategic partnership with Amkor Technology, Inc. (Nasdaq: AMKR), a provider of semiconductor packaging and test services, to create the largest-ever 3D-packaged chip complex utilizing Lightmatter’s innovative Passage platform. This collaboration harnesses Lightmatter’s groundbreaking 3D-stacked photonic engine along with Amkor’s advanced multi-die packaging expertise to […]
Optical I/O: Celestial AI Acquires Rockley Photonics Portfolio
October 22, 2024 by
SANTA CLARA, Calif. – October 23, 2024 – Photonic fabric company Celestial AI today announced the acquisition of silicon photonics intellectual property from Rockley Photonics (Rockley), including worldwide issued and pending patents. Celestial said the combination results in one of the strongest IP portfolios in the field of silicon photonics for optical compute interconnect, bringing their […]
Optical I/O: The Key to Unlocking AI Infrastructure, Profitability and Performance
October 1, 2024 by
[SPONSORED GUEST ARTICLE] Scaling GenAI inference performance requires increasing the number of GPUs or accelerators working in parallel within the scale-up domain. In-package optical I/O offers a path forward by breaking the ….
OpenLight and Epiphany Partner on Photonic Integrated Circuit Design
September 23, 2024 by
SANTA CLARA, Calif., Sept. 23, 2024 — PASIC chip design and manufacturing company OpenLight today announced a partnership with Epiphany, a fabless photonic design house, aimed at advancing the photonic integrated circuit (PIC) design ecosystem. Through this partnership, Epiphany will gain access to OpenLight’s open heterogeneously integrated III-V-based PDK, providing more options and flexibility for […]
Sandia and Arizona State to Integrate Photonics and Light-Wave Frequency for Quantum Processing
August 22, 2024 by
Aug. 22, 2024 — SandiaNational Laboratories and Arizona State University are collaborating to combine quantum technology and large-scale optical systems into integrated microsystems. Nils Otterstrom, a Sandia physicist specializing in integrated photonics, is working on scaling down optical systems to the size of a chip, which is intended to offer performance advantages and scalability for […]
Intel’s 4 TB/s Integrated Optical I/O Chiplet Called ‘Important Milestone’
June 26, 2024 by
Intel announced it has achieved an advance in integrated photonics technology for high-speed data transmission. The prototype OCI chiplet is designed to support 64 channels of 32 gigabits/second bidirectional data transmission on up to 100 meters of fiber optics ….
Ayar Labs Names Intel Veteran Pooya Tadayon VP of Packaging and Test
June 11, 2024 by
SAN JOSE – June 11, 2024 – Optical interconnect company Ayar Labs today announced the appointment of Pooya Tadayon as its Vice President of Packaging and Test. Tadayon was formerly a Fellow and Director of Assembly & Test Pathfinding within Intel’s Assembly and Test Technology Development (ATTD) group. Tadayon brings to Ayar Labs more than two […]
