Enabling Next-Generation Platforms Using Intel’s 3D System-in-Package Technology

White Papers > AI > Enabling Next-Generation Platforms Using Intel’s 3D System-in-Package Technology

This white paper evaluates system requirements for next-generation platforms and explains why conventional solutions may no longer be able to meet these requirements effectively. The paper introduces the heterogeneous 3D system- in-package (SiP) technology featured in Intel Stratix 10 FPGAs and SoCs. This technology enables next-generation platforms by powering higher bandwidth, lower power, a smaller form factor, and increased functionality and fledibility. Stratix 10 FPGAs and SoCs feature 3D SiP-based transceivers across all densities. This paper elaborates on the scalability, exibility, and fast time-to-market bene ts of this next-generation transceiver solution. Additionally, it enumerates the physical construct of the SiP technology, compares it with alternative approaches, and explains how this technology addresses speci c requirements for next-generation platforms.

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