ST. PAUL, Minn.– Ecolab Inc., a sustainability company offering water, hygiene and infection prevention solutions and services, announced the launch of an integrated cooling program for data centers. Ecolab’s Cooling as a Service (CaaS) program brings together a suite of cooling management solutions that unlock peak cooling performance all the way from the data center […]
Nortek Data Center Cooling Unveils Skidded CDU with Multi-Megawatt Capacity
September 24, 2025 by
OKLAHOMA CITY, September 24, 2025 – Nortek Data Center Cooling (Nortek DCC), a Madison Air company, today announced the launch of its Skidded Coolant Distribution Unit (CDU), a liquid cooling solution engineered for high-density AI, HPC and hyperscalers. Designed to scale beyond 5 megawatts, the skidded CDU delivers precision cooling while reducing on-site labor, accelerating deployment timelines and lowering […]
LiquidStack Unveils GigaModular Coolant Distribution Unit
June 3, 2025 by
CANNES, France, June 3, 2025 — LiquidStack today at Datacloud Global Congress unveiled its GigaModular CDU — a modular, scalable Coolant Distribution Unit with up to 10MW cooling capacity, made possible through the unit’s modular platform and pay-as-you-grow installation approach. Driven by increases in the adoption of AI, cloud computing, and other data-intensive technologies, the global […]
AIRSYS Cooling Breaks Ground on $40M HQ in South Carolina
May 8, 2025 by
WOODRUFF, S.C., May 8, 2025 – AIRSYS Cooling Technologies Inc. today broke ground on its new AIRSYS Global HQ building in Woodruff, SC. The more than 260,000-square-foot facility will house manufacturing, office, training and product showroom spaces and will be the manufacturing home for more than 20 different AIRSYS products. The new facility represents a $40-million investment […]
The AI Factory Heats Up: Liquid Cooling Options Explained
April 24, 2025 by
he compute power required by AI and HPC is skyrocketing and driving a global transition from 10-15 megawatt data centers to 50-100 megawatt and even gigawatt AI factories. With the next generation AI superchips operating at 2,800 watts and beyond, the amount of heat expected to be generated ….
The AI Factory Heats Up: Liquid Cooling Options Explained
April 24, 2025 by
The compute power required by AI and HPC is driving a transition from 10-15 megawatt data centers to 50-100 megawatt and even gigawatt AI factories. With next gen AI superchips operating at 2,800 watts and beyond ….
Liquid Cooling: CoolIT Systems Announces Row-Based Coolant Distribution Unit
April 15, 2025 by
Calgary, AB, April 15, 2025 — AI ad HPC liquid cooling company CoolIT Systems today introduced the CHx2000, which the company said is the highest-performance row-based coolant distribution unit (CDU). This follows CoolIT’s announcement of the CHx1500 CDU in early March 2025. In production and shipping from CoolIT’s multi-gigawatt capacity manufacturing facilities, CHx2000 offers a […]
Liquid Cooling: CoolIT Systems Announces Row-Based Coolant Distribution Unit
April 15, 2025 by
Calgary, AB, April 15, 2025 — AI ad HPC liquid cooling company CoolIT Systems today introduced the CHx2000, which the company said is the highest-performance row-based coolant distribution unit (CDU). This follows CoolIT’s announcement of the CHx1500 CDU in early March 2025. In production and shipping from CoolIT’s multi-gigawatt capacity manufacturing facilities, CHx2000 offers a […]
HPC News Bytes 20250407: Tariffs and the Technology Industry, Intel-TSMC Deal?, DARPA Taps Wafer Scale, Sandia and Laser-Based Cooling, Optical I/O News
April 7, 2025 by
Good April day to you! It was a wild week for more than the HPC-AI sector last week, here’s a brief (7:39) look at some key developments: U.S. tariffs, the technology sector and advanced chips, Intel-TSMC ….
Sandia Labs Tests Laser-Based Photonic Data Center Cooling
April 3, 2025 by
Minnesota-based startup Maxwell Labs has entered into an R&D agreement with Sandia and the University of New Mexico to demonstrate laser-based photonic cooling for computer chips. The company is working to develop the new technology to regulate the temperature of chips, while aiming to lower the power ….
