Intel and Hewlett Packard Enterprise (HPE) have recently created two new Centers of Excellence (CoE) to help customers gain hands-on experience with High Performance Computing (HPC). This plus collaboration with customers on implementing the latest technology solutions are highlights being celebrated by the two companies on the one-year anniversary of their alliance.
Today, the National Science Foundation (NSF) announced a $110 million award to the University of Illinois at Urbana-Champaign and 18 partner institutions to continue and expand activities undertaken through the Extreme Science and Engineering Discovery Environment (XSEDE).
Today Avere Systems and Cycle Computing announced a technology integration that enables hybrid high-performance computing (HPC) in popular public cloud computing environments. By integrating the Avere vFXT Edge filer cloud bursting technology with Cycle Computing’s CycleCloud offering, users are now able to launch an Avere tiered file system on demand linked directly with the CycleCloud managed scalable compute nodes through cloud providers like AWS, Google Cloud Platform and Microsoft Azure.
The Fujitsu Journal has posted details on a recent Hot Chips presentation by Toshio Yoshida about the instruction set architecture (ISA) of the Post-K processor. “The Post-K processor employs the ARM ISA, developed by ARM Ltd., with enhancements for supercomputer use. Meanwhile, Fujitsu has been developing the microarchitecture of the processor. In Fujitsu’s presentation, we also explained that our development of mainframe processors and UNIX server SPARC processors will continue into the future. The reason that Fujitsu is able to continuously develop multiple processors is our shared microarchitecture approach to processor development.”
Over at the ARM Community Blog, Nigel Stephens writes that the company has introduced scalable vector extensions (SVE) their A64 instruction set to bolster high performance computing. Fujitsu is developing a new HPC processor conforming to ARMv8-A with SVE for the Post-K computer.
Today SimScale in Germany announced a partnership with Autodesk, a leader in 3D design and fabrication software. The SimScale add-in for Autodesk Fusion 360 aims at improving the design engineering workflow between the design (CAD) and virtual testing phases (CAE). With the help of the add-in, users creating their 3D models in Autodesk Fusion 360 will be able to push their geometry directly to an existing CFD, FEA, or thermal analysis project on SimScale, where they can simulate it in the cloud.
In this video, ORNL researchers use supercomputers to simulate nanomanufacturing, the process of building microscopic devices atom by atom. Simulated here is the construction of a 250-nanometer 3-D cube by focused electron beam induced deposition.
For the first time, SC16 will offer childcare in the convention center to registered attendees and exhibitors. “This will provide an opportunity for the family to be together while one or both parents enjoy either parts or all of the conference. Of course, it is entirely optional, but we listened to our audience and this seemed to be a growing need. I realize this is a small step, but hopefully it is the first of many more small steps to come.”
Today the OpenPOWER Foundation announced that their inaugural OpenPOWER Summit Europe will take place Oct. 26-28 in Barcelona, Spain. Held in conjunction with OpenStack Europe, the OpenPOWER Summit Europe, the event will feature speakers and demonstrations from the OpenPOWER ecosystem, including industry leaders and academia sharing their technical solutions and state of the art advancements.
Wen-mei Hwu from the University of Illinois at Urbana-Champaign presented this talk at the Blue Waters Symposium. “In the 21st Century, we are able to understand, design, and create what we can compute. Computational models are allowing us to see even farther, going back and forth in time, learn better, test hypothesis that cannot be verified any other way, and create safe artificial processes.”