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Henry Newman on Why Tape is Dead

henry

In this video from the Nov. 17 Seagate User Group at SC14, Henry Newman from Instrumental presents: Tape vs. Disk 2015-2020. Transcript: So, I’m the last speaker between you and the opening gala event so I will talk quickly. Ken heard about a study we did for a government agency looking at long term archival issues […]

This Week in HPC: Exascale Bill Faces Uncertain Future in U.S. Senate, and HPC Gets in the Entrepreneurial Spirit

this week in hpc

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss how the recent election might affect spending for Exascale research. After the break, they preview the StartupHPC Meetup at SC14.

This Week in HPC: Cray and SGI Land Big HPC Contracts and IBM Teams Up with Twitter

this week in hpc

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss big wins for Cray and SGI. After the break they look at IBM’s big collaboration with Twitter.

This Week in HPC: IBM Hands Off Fabs to Global Foundries and Poland Gets its First Petaflop Super

this week in hpc

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss recent news that IBM is handing off the company’s chip fabs to Global Foundries. After the break, they look at the new Petaflop Apollo 8000 supercomputer coming to Cyfronet in Poland.

This Week in HPC: Supercomputing Future Uncertain for NSF, and Cray and SGI Unveil Big Data Appliances

this week in hpc

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss a recent National Research Council report that indicates the NSF is falling behind in supercomputing. After the break, they look at new Big Data Appliances from Cray and SGI.

This Week in HPC: HP Splits Up While AMD CEO Steps Down, Plus a Fall Conference Recap

this week in hpc

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss the split of HP and the new CEO at AMD. After the break, they look back on their recent travels to a series of Fall HPC conferences.

This Week in HPC: Cray Unveils Next Generation Supercomputer and DDN Extends Product Line with Scale-out Appliance

this week in hpc

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss the next generation Cray XC40 supercomputer with DataWarp technology as well the introduction of a new Scale-out Storage Appliance from DDN based on GPFS.

This Week in HPC: New Research from the U.S. Council on Competitiveness

this week in hpc

The SOLVE Report is here! The Council on Competitiveness, with support from the US Department of Energy, engaged Intersect360 Research to interview 100+ companies whose use of HPC increases their competitiveness in industries such as manufacturing, finance, pharmaceuticals, and chemical engineering. These findings were published in Solve, a publication exploring how U.S. investment in HPC benefits America’s industrial and economic competitiveness.

This Week in HPC: Startup Unveils Storage-Centric Architecture and PayPal Meets Moonshot

this week in hpc

In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research discuss the new Fortissimo Foundation from A3Cube, a clustered, pervasive, global direct-remote I/O access system. For more details, check out our A3Cube Slidecast over at insideBIGDATA. After that, they look at Paypal’s use of TI Keystone DSP processors for systems intelligence. By analyzing their chaotic real-time server data, Paypal is getting real-time, organized, intelligent results with extreme energy efficiency using HP’s Moonshot servers.

This Week in HPC: HPC Gets the Drop on Design Simulation: Collaboration with Dell, Intel, and Altair

this week in hpc

“Impact analysis or drop testing is one of the most important stages of product design and development, and software that can simulate this testing accurately yields dramatic cost and time-to-market benefits for manufacturers. Dell, Intel and Altair have collaborated to analyze a virtual drop test solution with integrated simulation and optimization analysis, delivering proven gains in speed and accuracy. With this solution, engineers can explore more design alternatives for improved product robustness and reliability.”