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Micron and Intel to continue joint development of 3D NAND Memory through 2019

Today Micron and Intel announced an update to their successful NAND memory joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market. “The companies have agreed to complete development of their third-generation of 3D NAND technology, which will be delivered toward the end of this year and extending into early 2019. Beyond that technology node, both companies will develop 3D NAND independently in order to better optimize the technology and products for their individual business needs.”

Future Technologies on the Rise for HPC

“2017 will see the introduction of many technologies that will help shape the future of HPC systems. Production-scale ARM supercomputers, advancements in memory and storage technology such as DDN’s Infinite Memory Engine (IME), and much wider adoption of accelerator technologies and from Nvidia, Intel and FPGA manufacturers such as Xilinx and Altera, are all helping to define the supercomputers of tomorrow.”

Intel Rolls Out New Xeon Processors & 3D NAND SSDs

Today Intel announced new technologies, investments and industry collaborations that make it easier for any business to harness the power of the cloud. The news featured the new Intel Xeon processor E5-2600 v4 product family (Broadwell), collaborations with leading cloud software and solution providers, and Intel’s first 3D NAND SSDs optimized for cloud and enterprise workloads.