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Liquid Cooling Ecosystem Expands for HPC with CoolIT Systems

In this video, CoolIT Systems debuts high TDP processor coldplates, STULZ Micro Data Center with Rack DCLC™, and new liquid cooled OEM servers at ISC High Performance 2017 in Frankfurt Germany.

STULZ and CoolIT Systems Launch Liquid Cooled Micro Data Center for HPC

“The Micro DC is a compact data center that can be easily deployed in any environment while managing an incredible amount of power and performance,” said Joerg Desler, President of STULZ USA. “It’s modular system is configured to use various combinations of liquid and air cooling allowing the system to grow with the customer’s needs. Integrating STULZ technology with CoolIT Systems Rack DCLC has resulted in ultra-efficient total thermal solutions that can support any OEM server at even the highest density configurations.”

CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling

In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmosphere™ data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems’ DCLC™ solutions can capture 85% and more of the servers’ heat directly into liquid. Complimenting DCLC™, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.