Sign up for our newsletter and get the latest HPC news and analysis.
Send me information from insideHPC:


Simplify Cluster Deployment with Intel HPC Orchestrator

“Intel HPC Orchestrator simplifies the installation, management, and ongoing maintenance of an HPC system by reducing the amounft of integration and validation effort required to run an HPC system software stack. With Intel HPC Orchestrator, based on the OpenHPC system software stack, you can take advantage of the innovation driven by the open source community – while also getting peace of mind from Intel® support across the HPC system software stack.”

Nvidia’s Bill Dally to Keynote HiPINEB 2017 Exascale Workshop

Nvidia’s Bill Dally will keynote HiPINEB 2017 – the 3rd IEEE International Workshop on High-Performance Interconnection Networks in the Exascale and Big-Data Era. The event takes place Feb. 5, 2017 in Austin, Texas and will be held in conjunction with the IEEE HPCA Conference.

CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling

In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmosphere™ data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems’ DCLC™ solutions can capture 85% and more of the servers’ heat directly into liquid. Complimenting DCLC™, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.

RSC Tornado Breaks Record with 1.41 Petaflops per Rack

Today Russia’s RSC Group announced that the company has achieved a record compute density of 1.41 Pflops per rack using direct liquid cooling and Intel Xeon Phi processors. “RSC supported the TUM student team from Munich with 8 nodes mobile cluster based on RSC Tornado direct liquid cooled architecture. This computing system provided stable operation of computing nodes in “hot water” mode at +63 °С cooling agent temperature at node inputs and had the following configuration: 72-cores Intel Xeon Phi 7290 processors, Intel S7200AP server boards, Intel SSD DC S3500 Series M.2 340 GB solid-state drives, switch and adapters based on Intel Omni-Path high-speed fabric, highly efficient Micron DDR4-2400 VLP 16-32 GB memory modules.”

Video: PASC17 Conference Seeks Papers, Minisymposia, and Posters

In this video, Jeff Hollingsworth from SIGHPC and Michele De Lorenzi from CSCS invite you to submit papers, minisymposia proposals and posters to the PASC17 Conference, an interdisciplinary conference in HPC that brings together domain science, applied mathematics and computer science. PASC17 will be held June 26-28, 2017 in Lugano, Switzerland.

Full Rundown of SC16 Stats, World Records, and Awards

The numbers are in for SC16, the international supercomputing conference that wrapped up last week in Salt Lake City. The conference drew more than 11,100 registered attendees and featured a technical program spanning six days. “The SC16 Exhibition was the largest in the history of the conference, with 349 exhibitors from industry, academia and research organizations from around the world.”

Video: Supermicro Showcases Machine Learning Solutions on Intel Architecture

In this video from the Intel HPC Developer Conference, Akira Sano from Supermicro describes the company’s Machine Learning Solutions on Intel Architecture. “Our server systems, subsystems and accessories are architecturally designed to provide high levels of reliability, quality and scalability, thereby enabling our customers benefits in the areas of compute performance, density, thermal management and power efficiency to lower their overall total cost of ownership.”

Asetek Liquid Cooling Delivers Savings and Flexibility for HPC

In this video from SC16, Steve Branton from Asetek describes the company’s innovative liquid cooling systems for high performance computing. Unlike one-size-fits-all approaches, the flexibility of Asetek distributed liquid cooling technology enables OEMs to provide a fit-to-need strategy that is compelling to the elite members of the supercomputing community. “With the accelerating trend of higher wattages and the continuing requirement of high density, the need for adaptable, cost effective, and reliable liquid cooling is accelerating among those striving to obtain TOP500 status. This need is exactly what Asetek’s distributed cooling architecture provides.”

Chinese Research Team Wins Gordon Bell Prize using #1 Sunway TaihuLight Supercomputer

A weather science team from China has won 2016 ACM Gordon Bell Prize for their research project, “10M-Core Scalable Fully-Implicit Solver for Nonhydrostatic Atmospheric Dynamics.” The winning team presented a method for calculating atmospheric dynamics on the world’s fastest computer, the 93 Petaflop Sunway TaihuLight system. “On the road to the seamless weather-climate prediction, a major obstacle is the difficulty of dealing with various spatial and temporal scales. The atmosphere contains time-dependent multi-scale dynamics that support a variety of wave motions.”

Why Intel Omni-Path is Growing Fast on the TOP500

In this video from SC16, Joe Yaworsky describes how Intel Omni Path is gaining traction on the TOP500. As the interconnect for the Intel Scalable System Framework, Omni-Path is focused on delivering the best possible application performance. “In the nine months since Intel Omni-Path Architecture (Intel OPA) began shipping, it has become the standard fabric for 100 gigabit systems. Intel OPA is featured in 28 of the top 500 most powerful supercomputers in the world announced at Supercomputing 2016 and now has 66 percent of the 100Gb market. Top500 designs include Oakforest-PACS, MIT Lincoln Lab and CINECA.”