Today the Barcelona Supercomputing Center (BSC) and French Alternative Energies and Atomic Energy Commission (CEA) announced plans to collaborate on HPC research and technology innovation. Both organizations have signed an agreement to help promoting “a globally competitive HPC value chain and flagship industry”, echoing the European Union strategy in the domain.
“In April 2015, the U.S. Department of Energy announced a $200 million supercomputing investment coming to Argonne National Laboratory. As the third of three Coral supercomputer procurements, the deal will comprise an 8.5 Petaflop “Theta” system based on Knights Landing in 2016 and a much larger 180 Petaflop “Aurora” supercomputer in 2018. Intel will be the prime contractor on the deal, with sub-contractor Cray building the actual supercomputers.”
In this video from ISC 2015, Intel’s Raj Hazra explores how new innovations and Intel’s Scalable System Framework approach can maximize the potential in the new HPC era. Raj also shares details of upcoming Intel technologies, products and ecosystem collaborations that are powering these breakthroughs and ensuring technical computing continues to fulfill its potential as a scientific and industrial tool for discovery and innovation.
In this video, the Radio Free HPC team looks at the newly announced 3D XPoint technology from Intel and Micron. “3D XPoint ushers in a new class of non-volatile memory that significantly reduces latencies, allowing much more data to be stored close to the processor and accessed at speeds previously impossible for non-volatile storage.”
Today Intel Corporation and Micron Technology unveiled 3D XPoint technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989.