In this video, the Radio Free HPC team looks at the newly announced 3D XPoint technology from Intel and Micron. “3D XPoint ushers in a new class of non-volatile memory that significantly reduces latencies, allowing much more data to be stored close to the processor and accessed at speeds previously impossible for non-volatile storage.”
Today Intel Corporation and Micron Technology unveiled 3D XPoint technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989.
NVM Express is a specification for accessing solid-state drives (SSDs) attached through the PCI Express (PCIe) bus. “NVM” stands as an acronym for non-volatile memory, which is used in SSDs. As a logical device interface, NVM Express has been designed from the ground up, capitalizing on the low latency and parallelism of PCI Express SSDs, and mirroring the parallelism of contemporary CPUs, platforms and applications. By allowing parallelism levels offered by SSDs to be fully utilized by host’s hardware and software, NVM Express brings various performance improvements.
“The DDN Infinite Memory Engine (IME) unleashes a new I/O provisioning paradigm. This breakthrough, software defined storage application introduces a whole new new tier of transparent, extendable, non-volatile memory (NVM), that provides game-changing latency reduction and greater bandwidth and IOPS performance for the next generation of performance hungry scientific, analytic and big data applications – all while offering significantly greater economic and operational efficiency than today’s traditional disk-based and all flash array storage approaches that are currently used to scale performance.”