“The Micro DC is a compact data center that can be easily deployed in any environment while managing an incredible amount of power and performance,” said Joerg Desler, President of STULZ USA. “It’s modular system is configured to use various combinations of liquid and air cooling allowing the system to grow with the customer’s needs. Integrating STULZ technology with CoolIT Systems Rack DCLC has resulted in ultra-efficient total thermal solutions that can support any OEM server at even the highest density configurations.”
Search Results for: coolit
Peter Calverley Joins CoolIT Systems’ Board of Directors
April 26, 2017 by
Today CoolIT Systems announced that Peter Calverley, CFO of Tela Innovations, has been elected to CoolIT’s Board of Directors. Doug Reid has retired from the Board after 5 years of service. “I am excited to join the Board of Directors at CoolIT Systems – a company leading the industry with its innovative, energy efficient direct contact liquid cooling solutions,” said Peter Calverley. “I believe CoolIT’s unmatched technology presents an enormous opportunity to facilitate a step-change in data center computational capabilities.”
CoolIT Systems Issued U.S. Patent for Modular Heat-Transfer Solutions
February 9, 2017 by
“U.S. Patent 9,496,200 protects the invention of utilizing a modular, building block approach for datacenter cooling with direct contact liquid cooling,” said Geoff Lyon CEO, CoolIT Systems. “CoolIT’s commitment to developing and patenting unique solutions provides our customers with the assured competitive advantage they are looking for. The 60 patent milestone adds confirmation to CoolIT’s leadership in developing innovative liquid cooling solutions for modern data centers.”
CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling
November 28, 2016 by
In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmosphere™ data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems’ DCLC™ solutions can capture 85% and more of the servers’ heat directly into liquid. Complimenting DCLC™, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.
CoolIT Systems Showcases HPC Liquid Cooling at SC16
November 15, 2016 by
“We have assembled a comprehensive display of technology and OEM solutions to address all liquid cooling requirements in the global HPC market,” said CoolIT Systems CEO and CTO Geoff Lyon. “Our partnership with STULZ provides the market with the benefits of a single vendor to implement and service HPC cooling solutions in over 140 countries – truly a unique offering.”
Job of the Week: Enterprise Account Manager at CoolIT Systems in Connecticut
July 20, 2016 by
CoolIT Systems in New York is seeking an Enterprise Account Manager with experience in Data Center infrastructure in our Job of the Week.
The Liquid Cooling Revolution Continues for HPC with CoolIT Systems
July 12, 2016 by
In this video, CoolIT Systems CEO & CTO, Geoff Lyon, reveals details on the company’s next generation liquid cooling solutions for HPC, Cloud and Enterprise markets during ISC HPC 2016 in Frankfurt. Discussion highlights include OEM server solutions, customer case studies, product launches and more. “To learn more about how CoolIT Systems products and solutions maximize data center performance and efficiency whilst significantly reducing OPEX and overall TCO, visit www.coolitsystems.com.”
CoolIT Systems Rolls Out Rack DCLC CHx80 Heat Exchange Module
June 17, 2016 by
Today CoolIT Systems rolled out its new CHx80 Heat Exchange Module. As part of an expanded its Rack DCLC product line, this next generation liquid-to-liquid heat exchanger provides cooling capacity with N+1 reliability to manage the most challenging, high density HPC racks. CoolIT will showcase the rack-mount CHx80 at ISC16 in Frankfurt.
CoolIT Systems to Showcase Next Generation Liquid Cooling at ISC 2016
June 14, 2016 by
Today CoolIT Systems announced that the company will showcase its energy efficient liquid cooling technologies for HPC at ISC 2016 in Frankfurt. “Our comprehensive offering of energy efficient liquid cooling solutions at ISC16 far exceeds anything CoolIT has done in the past,” says CoolIT Systems CEO and CTO Geoff Lyon. “With Europe at the forefront of energy efficient HPC, attendees can discover how rapidly the liquid cooling market is maturing, as evidenced by our growing list of global customers and OEM partners.”
CoolIT Systems Partners with STULZ on Chip-to-Atmosphere Cooling
May 24, 2016 by
Today CoolIT Systems announced a commercial partnership with STULZ USA. Under the agreement, the two companies will cooperate closely in delivering unique Chip-to-Atmosphere solutions across the globe.
