Thermoplastic Connectors Grow in Popularity Along with Liquid Cooling

As liquid cooling becomes more and more prevalent, new technology and types of connectors are becoming water cooler topics for those in the data and computing industries. According to a new report from CPC, long-term, leak-free performance in fluid management systems requires robust connectors. And advanced materials are growing the range of available QD options.

Metal or Plastic Quick Disconnects? Key Considerations

Long-term, leak-free performance in fluid management systems requires robust connectors. As liquid cooling is increasingly deployed in high performance computing and data center applications, these industries demand quick disconnects (QDs) purpose-built for their needs. Gone are the days of making do with metal ball-and-sleeve connectors designed for heavy industrial use. Download the new guide from CPC that outlines key performance factors of new PPSU QDs compared to traditional all-metal QDs for liquid cooling.

Cooling Challenges for Ultra-high Density Compute Clusters

Miguel Terol from Lenovo gave this talk at HPCKP’19. “Technology players are refining their chip and platform designs to enable much denser systems. The trade-off of this trend is chips are getting more and more power hungry, and cooling those components becomes a challenge in terms of sustainability, either for the environment or the economy. In this talk we will present the high density technology landscape and different approaches to address the cooling challenges.”

GRC Launches Immersion Cooled Micro-Modular Data Center Solution

Today GRC announced the launch of a new micro-modular data center solution, the ICEraQ Micro, a rapidly deployable self-contained 24U server rack that can support up to 50kW of critical IT load and is nearly half the cost of other micro-modular solutions. “ICEraQ Micro gives IT professionals the freedom to easily add high-density computing, virtually anywhere.”

DUG Opens the Doors for 250 PF Bubba Supercomputer in Houston

Today DownUnder GeoSolutions (DUG) opened its giant new data center in Skybox Houston. Touted to be one of the most powerful supercomputers on earth, the facility is home to the company’s geophysical cloud service, DUG McCloud. “DUG is offering a unique cloud product including compute, storage, geophysical software, and services, initially with a massive 250 PF of geophysically-configured compute ready to go,” said DUG’s Managing Director, Dr Matthew Lamont.

CoolIT Systems Launches Liquid Cooling Solution for Intel Server System S9200WK

Today CoolIT Systems announced an integrated liquid cooling solution to support the Intel Server System S9200WK. “The Intel Server System S9200WK uses CoolIT’s innovative Rack DLC coldplate solution, featuring patented Split-Flow design. The liquid cooling solution for this 2U, four node server manages heat from the recently announced dual Intel Xeon Platinum 9200 processor CPUs, voltage regulators, and memory.”

DUG Installs Immersive Cooling for Bubba Supercomputer in Houston

Today DownUnder GeoSolutions (DUG) announced that tanks are arriving at Skybox Houston for “Bubba,” its huge geophysically-configured supercomputer. “DUG will cool the massive Houston supercomputer using their innovative immersion cooling system that has computer nodes fully submerged in specially-designed tanks filled with polyalphaolefin dielectric fluid. This month, the first of these 722 tanks have been arriving in shipping containers at the facility in Houston.”

GRC Partners to Provide Worldwide Support and Server Warranties for Immersion Cooling

We’ve been hearing more and more about immersive cooling for HPC, but what happens to system warranties in these kinds of installations? Today GRC took a step to ease these concerns through collaboration with TechData to provide support and warranties for worldwide customers submerging servers and other equipment in GRC’s immersion cooling systems. “As we grow our global footprint, it is wonderful to add TechData to our network of partners, while providing customers with added peace of mind,” said Peter Poulin, CEO of GRC.

Submer SmartPodX Platform launches for OCP Immersion Cooling

Today the European Submer startup announced that their latest SmartPod Immersion Cooling System conforms to both standard server formats and to Open Compute Project (OCP) specifications for high-performance, supercomputing, and hyperscale infrastructures – the SmartPodX. “The Open Compute Project exists to develop open standards that bring greater efficiency, scalability, openness, and positive impact to datacenters and hardware – making all of our lives better,” said Submer CEO Daniel Pope. “This makes the OCP Global Summit the perfect opportunity to launch our hyper-efficient SmartPodX that will power the next generation of high-performance servers and supercomputers that usher in the next wave of research and technical innovation.”

Video: Submer Technology for HPC Immersion Cooling

In this video, Diarmoid Daltun from Submer and Daniele Rispoli from ClusterVision describe how Immersion Cooling applies to a HPC installation, including the benefits, challenges, economics, practicality, and more. “We are a cleantech company that designs, builds and installs Liquid Immersion cooling solutions for HPC, hyperscaler, datacenters, Edge, AI, deep learning and blockchain applications. Set apart by its modular design, our technology is the most practical, resilient, eco-friendly and highly efficient Immersion Cooling solution.”