San Jose, Sept. 14, 2021 – Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today announced the development of a 112Gb/s interconnect technology built on their products. This combined solution is […]
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Chenbro Launches RM252/RM352 Short Depth Edge Computing Server Chassis Series for 5G
July 28, 2021 by
Taipei, Taiwan, July 27, 2021 – Chenbro (TWSE: 8210), a maker of own-brand rackmount system, announced the RM252 and RM352 series, its latest short depth 2U and 3U edge computing server chassis, to support complex industrial applications in the 5G era. Empowered by optimized I/O design, both RM252 and RM352 series offer FIO (Front I/O) […]
Quobyte Releases Hadoop Native Driver for Analytics, ML, Streaming and Real-time Applications
July 21, 2021 by
SANTA CLARA, CA, July 21, 2021 — Quobyte Inc., a developer of scale-out software-defined storage (SDS), today announced availability of its Hadoop Driver. Quobyte’s new native driver for Hadoop addresses the limitations of the Hadoop Distributed File System’s (HDFS) high-capacity design within the enterprise. The new native driver brings significant benefits in optimizing Hadoop clusters for a much wider […]
Molex Scales Deployments of High-Speed Interconnect for Hyperscale and Data Centers
April 29, 2021 by
LISLE, IL – April 29, 2021 – Molex, a leading global connectivity and electronics solutions provider, is scaling global deployments of its high-speed copper and optical interconnects and modules to help customers better address demands for higher bandwidth. Molex’s broad portfolio of next-generation connectivity solutions leverage the latest advancements in copper and optics to deliver high signal integrity, lower […]
SingleStore Adds AWS Glue for Simpler Cloud Data Integration
January 6, 2021 by
San Francisco – Jan. 6, 2021 – Database company SingleStore, for operational analytics and modern applications, today unveiled native support for AWS Glue, expanding its cloud data integration. This enables developers, data engineers, and data scientists to build with SingleStore on Amazon Web Services (AWS) more easily. AWS Glue is a serverless data preparation service […]
Accern Upgrades No-Code, AI Platform with Features for Financial Services
December 21, 2020 by
New York, December 18, 2020 — Accern Corporation, a no-code, artificial intelligence (AI) company, today released an upgrade of its platform providing designed for easy navigation, accelerated performance and customizable features. Data science, product and technology teams can use Accern’s platform to accelerate the implementation of AI and machine learning (ML) into their workflows without […]
GigaSpaces Announces Version 15.5 for Hybrid and Multi-Cloud Deployments to Empower Digital Transformation Initiatives
September 2, 2020 by
New York — September 2, 2020 —GigaSpaces, the provider of InsightEdge, the fastest in-memory data and analytics processing platform, announced today the release of GigaSpaces InsightEdge version 15.5, to simplify and scale hybrid and multi-cloud deployments to empower digital transformation initiatives. GigaSpaces version 15.5 adds new efficiency and automation capabilities to its Ops Manager module for easier […]
Inspur Launches Server for Mobile Liquid Cooling Cluster
July 22, 2020 by
Data center infrastructure provider Inspur Information has announced a plate liquid-cooling 2U 4-node server, the i24M5-LC, that the company said is optimized for large-scale water-cooling server data centers with PUE<1.2. Inspur said the i24M5-LC, built for HPC and cloud data centers, adopts a liquid cooling design based on....
Liquid Cooling Trends in HPC
January 24, 2020 by
In this special guest feature, Bob Fletcher from Verne Global reflects on how liquid cooling technologies on display at SC19 represent more than just a wave. “My intuition suggests that the larger established water-cooling users will mostly stick with their familiar high-pressure solution, but the newer green field deployments will be fertile ground for the new vacuum CDUs. In particular, the AI community as their compute accelerators become increasingly water-cooled, while maintaining their short 2-year product life.”
Inspur Showcases HPC & AI Solutions at SC19
December 4, 2019 by
In this video from SC19, Vangel Bojaxhi from Inspur describes the company’s innovative solutions for HPC & AI. At the show, the company featured a broad array of HPC & AI servers based on x86 and OpenPOWER as well as a new liquid cooling system. “Through engineering and innovation, Inspur delivers cutting-edge computing hardware design and extensive product offerings to address important technology arenas like open computing, cloud data center, AI and deep learning. Performance-optimized and purpose-built, our world-class solutions empower customers to tackle specific workloads and real-world challenges.”
