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HPC End User Survey: Intel Xeon Still Dominates but AMD EPYC Gaining

Industry analyst firm Intersect360 has released partial results from an HPC end-user survey identifying the top user-rated processors, servers and cloud vendors. The key finding, according firm CEO Addison Snell: the disconnect between the HPC users, who want integration of Nvidia GPUs with CPUs from Intel or AMD, over against HPC vendors developing their own integrated solutions.

Video: AMD’s next Generation GPU and High Bandwidth Memory Architecture

“HBM is a new type of CPU/GPU memory (“RAM”) that vertically stacks memory chips, like floors in a skyscraper. In doing so, it shortens your information commute. Those towers connect to the CPU or GPU through an ultra-fast interconnect called the “interposer.” Several stacks of HBM are plugged into the interposer alongside a CPU or GPU, and that assembled module connects to a circuit board. Though these HBM stacks are not physically integrated with the CPU or GPU, they are so closely and quickly connected via the interposer that HBM’s characteristics are nearly indistinguishable from on-chip integrated RAM.”