“Accelerated computing is the only path forward to keep up with researchers’ insatiable demand for HPC and AI supercomputing,” said Ian Buck, vice president of accelerated computing at NVIDIA. “Deploying CPU-only systems to meet this demand would require large numbers of commodity compute nodes, leading to substantially increased costs without proportional performance gains. Dramatically scaling performance with fewer, more powerful Tesla P100-powered nodes puts more dollars into computing instead of vast infrastructure overhead.”
Today Asetek announced plans to showcase its liquid cooling solutions and successful installations at ISC 2016 in Frankfurt. “For the first time, Asetek will be displaying its new InRackCDU cooling solution. InRackCDU provides the option of having RackCDU mounted in the server rack. InRackCDU does not take up aisle space and includes the same monitoring features as Asetek’s VerticalRackCDU.”
Beth Wingate from the University of Exeter presented this talk at the PASC16 conference in Switzerland. “For weather or climate models to achieve exascale performance on next-generation heterogeneous computer architectures they will be required to exploit on the order of million- or billion-way parallelism. This degree of parallelism far exceeds anything possible in today’s models even though they are highly optimized. In this talk I will discuss the mathematical issue that leads to the limitations in space- and time-parallelism for climate and weather prediction models – oscillatory stiffness in the PDE.”
Today EXTOLL in Germany released its new TOURMALET high-performance network chip for HPC. “The key demands of HPC are high bandwidth, low latency, and high message rates. The TOURMALET PCI-Express gen3 x16 board shows an MPI latency of 850ns and a message rate of 75M messages per second. The message rate value is CPU-limited, while TOURMALET is designed for well above 100M msg/s.”
Today ASRock Rack announced plans to showcase its 2U and 3U systems for the HPC market at ISC 2016. “First of all, ASRock Rack is showing its new product 3U16N, which is by far the highest-density among all the microservers features with Intel Xeon D processors. With multiple computing nodes, this microserver can easily handle intensive critical tasks under low power consumption.”
“Supercomputers are key to the Cancer Moonshot. These exceptionally high-powered machines have the potential to greatly accelerate the development of cancer therapies by finding patterns in massive datasets too large for human analysis. Supercomputers can help us better understand the complexity of cancer development, identify novel and effective treatments, and help elucidate patterns in vast and complex data sets that advance our understanding of cancer.”
Efforts to Broaden HPC Accelerate as OpenHPC Governing Board and Technical Steering Committee Takes Shape
Since its announcement at SC15 in November, the OpenHPC community has made important strides toward its mission of creating and supporting a flexible open source HPC software stack that simplifies deploying and managing HPC systems. In just a few short months, the open source community hosted at The Linux Foundation has had many productive working group discussions, installed a Technical Steering Committee (TSC) and Governing Board, and even provided releases of the initial software stack based on early community feedback. The initial software stack includes over 60 packages, including tools and libraries, as well as provisioning, a job scheduler and more.
Today Italy’s E4 Computer Engineering announced plans to showcase of new NVIDIA GPU-accelerated OpenPOWER servers at ISC 2016 in Frankfurt. “For this edition of ISC16, we wanted to reinforce the message that E4 is a company that actively engages and pursues new technologies’ paths with the aim to deliver leading-edge solutions for a number of demanding environments,” said Piero Altoè, Marketing and BDM Manager, E4 Computer Engineering. “Our priority is to collaborate with organizations such as OpenPOWER Foundation and true visionaries like NVIDIA in order to obtain powerful, scalable and affordable solutions for a number of complex applications and contribute to the development of technologies that have a huge impact on many aspects of our lives.”
Today CoolIT Systems rolled out its new CHx80 Heat Exchange Module. As part of an expanded its Rack DCLC product line, this next generation liquid-to-liquid heat exchanger provides cooling capacity with N+1 reliability to manage the most challenging, high density HPC racks. CoolIT will showcase the rack-mount CHx80 at ISC16 in Frankfurt.
The vector parallel capabilities of the Intel Xeon Phi coprocessor are similar in many ways with vectorizing code for the main CPU. The performance improvement when coding smartly and using the tools available can be tremendous. Since the Intel Xeon Phi coprocessor can show very large gains in performance due to its extra wide processing units. “Although it is time consuming to look at each and every loop in a large application, by doing so, and both telling the compiler what to do, and letting the compiler do its work, performance increases can be quite large, leading to shorter run times and/or more complete results.”