BEAVERTON, Ore.– AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta and Microsoft today announced they have aligned to develop a new industry standard dedicated to advancing high-speed and low latency communication for scale-up AI systems linking in data centers. Called the Ultra Accelerator Link (UALink), this initial group will define and establish an […]
At ISC 2024: Intel’s Open Software Strategy for HPC and AI
At ISC 2024, we spoke with Andrew Richards, CEO of Codeplay Software, an Intel company based in Edinburgh. Richards tells us about Codeplay’s role in supporting the ecosystem for oneAPI, Intel’s unified programming model ….
HPE Delivers 2nd Exascale Supercomputer, Aurora, to Argonne National Laboratory
HAMBURG – At ISC High Performance 2024, Hewlett Packard Enterprise (NYSE: HPE) announced that it has delivered the world’s second exascale supercomputer, Aurora, in collaboration with Intel for the United States Department of Energy’s Argonne National Laboratory. Aurora has reached 1.012 exaflops on 87 percent of the system, making it the world’s second-fastest supercomputer as verified […]
Diane Bryant Named to Celestial AI Board
SANTA CLARA, CA – April 29, 2024 – Optical interconnect company Celestial AI today announced the appointment of Diane Bryant to the company’s board of directors effective April 11, 2024. With more than 30 years of semiconductor, AI and public and private company experience, Bryant currently serves as an independent board member at Broadcom and […]
Lenovo Launches AI Servers with AMD MI300X GPUs
Lenovo today announced AI-centric infrastructure systems in collaboration with AMD, including the ThinkSystem SR685a V3 8GPU server (pictured here), designed for demanding AI workloads, including genAI and large language models. The server, powered by 4th Generation AMD EPYC Genoa ….
DOD to Leverage Intel Foundry’s Advanced Process Technology
DOD has awarded Phase Three of its Rapid Assured Microelectronics Prototypes – Commercial program to Intel Foundry. This means RAMP-C customers can manufacture prototypes on Intel 18A, the company’s most advanced process technology. Although Intel and DOD did not disclose the dollar….
Former Intel Executive Thomas Lantzsch Joins Canatu Board
VANTAA, FINLAND, April 16, 2024 — Canatu, a developer of carbon nanotubes (Canatu CNTs) and manufacturing equipment for the semiconductor and automotive industries, today announced the appointment of former Intel executive Thomas Lantzsch to Canatu’s Board of Directors. He has more than 40 years of experience as an executive business leader across Fortune 500 companies […]
HPC News Bytes 20240401: A $100B AI Data Center, Eviden Says It’s Healthy, Alibaba’s RISC-V Chip, New Optical Interconnect Group, Nvidia Fights CUDA Translation
Happy April Fool’s Day! It was as always an interesting week in the world of HPC-AI, this edition of HPC News Bytes includes commentary on: Microsoft and….
HPC News Bytes 20240325: Final GTC Thoughts, Intel and CHIPS Act Largesse, Ultra Ethernet Consortium Expands, Samsung’s GPU/HBM Chip
A happy end-of-March morning to you! Here’s a rapid (5:57) run-though of the latest news in HPC-AI, including: final reflections on Nvidia GTC 2024, Intel to receive $8.5 billion via US CHIPS Act, the expanding Ultra Ethernet Consortium, Samsung’s upcoming GPU/HBM blend.